Circuit encapsulation process

Details Circuit encapsulation process Circuit encapsulation process

1994-11-15

1998-03-17

Graybill, David

Fishing, trapping, and vermin destroying

437212, 437214, 437216, 437219, 26427217, H01L 2156, H01L 2158, H01L 21603

Patent

active

057286000

ABSTRACT:
A method for encapsulating portions of a circuit formed on a substrate. The substrate has two faces and perimeter sides. Encapsulating surrounds, in molding compound, a portion of one of the faces of the substrate and a portion of the sides of the substrate, and during encapsulation a portion of the one face of the substrate that bears conductive pads is left unencapsulated.
An encapsulated circuit including a substrate having two faces and perimeter sides around the faces and a circuit formed on the substrate. The substrate also includes conductive pads that are formed on a portion of one of the faces near one of the sides and are connected to the circuit. An integrally formed encapsulating mass encapsulates all of the one face except in the region of the pads, all of the other face except in a region opposite to the region of the pads, and all of the sides.

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