Circuit elements for microwave and millimeter-wave bands and met

Wave transmission lines and networks – Dissipating terminations for long lines – Fluid-cooling

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264 17, 264112, 343910, 333 33, 333 81B, 3332191, 333258, H01P 126

Patent

active

054691281

ABSTRACT:
A circuit element for microwave and millimeter-wave bands and a method of producing the same. A dielectric line is made of a pure dielectric resin. A high-frequency wave absorbing member is made of a pure dielectric resin containing at least one of first, second and third powders dispersed therein. The first powder having a high specific inductive capacity, the second powder having a high magnetic permeability, and the third powder having a high specific resistance. A compression molding technique is used to fusion bond the high-frequency wave absorbing member to the dielectric line.

REFERENCES:
patent: 4020427 (1977-04-01), Connerney et al.
patent: 4458218 (1984-07-01), Babbitt et al.
patent: 4463330 (1984-07-01), Yoneyama

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