Circuit distribution to multiple integrated circuits

Details Circuit distribution to multiple integrated circuits Circuit distribution to multiple integrated circuits

2011-08-16

2011-08-16

Semenenko, Yuriy (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S790000

Reexamination Certificate

active

08000106

ABSTRACT:
A semiconductor system in a package separates those circuits in a field programmable gate array (FPGA) into two substrates. In particular, the logic elements are formed in a first semiconductor substrate and certain non-logic elements are formed in a second semiconductor substrate that is in mechanical and electrical connection with the first substrate. The two substrates are enclosed in a suitable protective package and electrical connections are provided between one or both substrates and the exterior. The non-logic elements formed in the second substrate are located in circuits that would have a signal propagation delay in a conventional FPGA that is more than approximately twice the interconnect delay between the two substrates.

REFERENCES:
patent: 4582975 (1986-04-01), Daughton
patent: 5455445 (1995-10-01), Kurtz et al.
patent: 2005/0205970 (2005-09-01), Chen et al.
patent: 2008/0122075 (2008-05-01), Bauer et al.
patent: 2008/0212355 (2008-09-01), Khanuja et al.
patent: 2009/0145631 (2009-06-01), Gabara

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