Circuit devices and fabrication method of the same

Details Circuit devices and fabrication method of the same Circuit devices and fabrication method of the same

1994-03-02

1997-02-04

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, 174261, 174264, H05K 100

Patent

active

056001037

ABSTRACT:
A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet. Moreover, the conductive bumps can be properly electrically Connected to an opposed conductive layer. Thus, the circuit component provides high reliability and contributes to high yield and fabrication efficiency.

REFERENCES:
patent: 3488429 (1970-01-01), Boucher
patent: 3524960 (1970-08-01), Lohff
patent: 3835531 (1974-09-01), Luttmer
patent: 4584767 (1986-04-01), Gregory
patent: 4991285 (1991-02-01), Shaheen et al.
patent: 5219639 (1993-06-01), Sugawara et al.
patent: 5440075 (1995-08-01), Kawakita et al.

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