Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-05-26
2008-10-21
Doan, Theresa T. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S717000, C257S712000, C257S713000, C257SE23101, C257SE23106
Reexamination Certificate
active
07439614
ABSTRACT:
In a manufacturing method of a hybrid integrated circuit device10according to the present invention, a first dummy pattern D1is provided on a first wiring layer18A. Furthermore, a second dummy pattern D2is provided on a second wiring layer18B. The first dummy pattern D1and the second dummy pattern D2are connected through a connection part25which penetrates an insulation layer17. Hence, heat dissipation through a dummy pattern can be actively performed. In addition, even in the cases where a multi-layered wiring is formed, it is possible to provide a circuit device which can secure a heat dissipation property.
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Inoue Yasunori
Kohara Yasuhiro
Nakamura Takeshi
Takakusaki Nobuhisa
Usul Ryosuke
Doan Theresa T.
Fish & Richardson P.C.
Salerno Sarah K
Sanyo Electric Co,. Ltd.
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