Circuit device integrity evaluation arrangement and method

Details Circuit device integrity evaluation arrangement and method Circuit device integrity evaluation arrangement and method

1998-08-17

2000-05-30

Noori, Max

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

73848, 73849, G01N 320

Patent

active

060678607

ABSTRACT:
According to one aspect of the disclosure, the present invention provides methods and arrangements for testing the integrity of laminate and solder adhesion strength in circuit devices. Methods include securely mounting one end of a circuit device, and affixing a rotatable shaft attached to a controllable servo motor to the other end of the circuit device. The circuit device is monitored so as to be able to detect failure, and torque is applied to the circuit device from the servo motor. When failure of the circuit device is detected, the torque is reduced.

REFERENCES:
patent: 4282759 (1981-08-01), Merrell
patent: 4292852 (1981-10-01), Morris
patent: 5184517 (1993-02-01), Kelzer
patent: 5447072 (1995-09-01), Holung
patent: 5567884 (1996-10-01), Dickinson et al.
Torque Stress Analysis for Printed Circuit Boards Carrying Peripherally Leaded Modules, Peter A. Engel, IBM Corp. (No Date).
Advances in Electronic Packaging, vol. 2, American Society of Mechanical Engineers, presented at INTERpack '95, Mar. 26-30, 1995.

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