Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2000-08-18
2003-03-04
Paladini, Albert W. (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S259000, C361S780000, C361S794000, C333S185000, C333S204000, C333S246000, C333S247000, C029S830000
Reexamination Certificate
active
06528732
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a circuit device board, a semiconductor component, and a method of fabricating the same. More specifically, the circuit device board is fabricated by: forming a first conductor pattern, which determines the function of the circuit device, on one side of a first dielectric substrate having two conductive layers provided on both sides thereof respectively; forming a second conductor pattern, which is substantially identical in the shape to the first conductor pattern when the two patterns are placed one over the other, on one side of a second dielectric substrate having two conductive layers provided on both sides thereof respectively; and bonding the first dielectric substrate and the second dielectric substrate to each other by an adhesive dielectric layer so that the first conductor pattern and the second conductor pattern can overlap each other. Also, while a semiconductor device is connected with the first or second conductor pattern, the first conductor pattern and the second conductor pattern are connected to each other for input and output of signals. Accordingly, a desired level of the frequency response can be obtained regardless of the thickness of the adhesive dielectric layer which joins the two dielectric substrates.
2. Description of the Related Art
For transmission of data at a higher speed over a radio link or a cable line in the sharply developing communications technology, a variety of circuit blocks are installed in relevant apparatuses such as mobile communications instruments, ISDN appliances, or computers.
As equipped with such a circuit block, every arrangement is desired to minimize the effect of noise while conduct the transmission of data at a high speed. It is also essential for portable communications apparatuses to decrease the size of components, have the components integrated, and provide multi-function types of the components. For example, for implementing a functional block in a high-frequency circuit, distributed constant circuits are commonly used for minimizing and integrating filters, high-frequency matching circuits, or coupler circuits, because a VCO (voltage controlled oscillator) or a filter is hardly feasible with the use of semiconductor devices as its wavelength becomes short.
It is known that development at high accuracy of an advanced band-pass filter on a substrate is implemented using a co-planar waveguide or a microstrip which is a planar transmission line with a ¼&lgr; coupling path (&lgr; being a wavelength). However, such a conventional circuitry arrangement is developed on the surface of a substrate and may thus possibly generate interference with other external circuits. The arrangement may also emit electromagnetic waves causing malfunction of adjacent devices. It is hence necessary for minimizing the effect of electromagnetic waves to shield the entire arrangement or to protect with an electromagnetic waves absorbing material. This will make the arrangement very intricate and increase the overall dimensions, resulting in the cost up. Moreover, the circuitry arrangement is normally developed along a plane and will thus be increased in the size when the frequency is within a relatively lower range.
The circuitry arrangement such as a band-pass filter is modified to have a combination of the step impedance resonance structure and the strip line structure where the signal lines are sandwiched between two grounding conductors for minimizing the effect of electromagnetic waves, whereby its side can be decreased by minimizing the resonator.
FIG. 1
illustrates such a band-pass filter having the step impedance resonance structure, where two dielectric substrates
202
are installed between external grounding conductors
201
while a resonator
203
comprising a couple of signal conductive layers which are different in the impedance is sandwiched between the two dielectric substrates
202
. The frequency response of the band-pass filter of
FIG. 1
is graphed in
FIG. 2
where f
0
is a center frequency and WT is a transmissive band width.
A circuit device board incorporating the band-pass filter shown in
FIG. 1
is declined in the frequency response if there are generated variations in the thickness of dielectric substrates or in the accuracy of fabricating conductor patterns which determine the function of a circuit device.
FIG. 3
illustrates the relation in change between the dielectric substrate thickness and the center frequency. For example, when the dielectric substrate thickness is varied 5%, the center frequency may change substantially 1% to 2%. With 5 GHz of the center frequency of the band-pass filter, the frequency will change up to 100 MHz at maximum and hardly be feasible. For eliminating undesired variations in the frequency response, it is needed to fabricate the substrates and the patterns at a considerable level of accuracy and the band-pass filter will thus be costly.
To decrease the cost of front-end devices of a specific communications apparatus using microwaves or milliwaves, the substrates are formed of organic materials such as fiber glass based epoxy resin or fiber glass based BT bismaleimide-triazine) resin instead of traditional ceramic materials. Such organic substrates are however different and more difficult in the fabrication than the traditional ceramic substrates. Particularly, a layer arrangement of the band-pass filter where a plurality of organic substrates are placed one over another possibly finds difficult in controlling the thickness of an adhesive layer which is a part of the dielectric film and its filtering characteristic will hardly stay at a desired level.
FIGS. 4A and 4B
each shows an arrangement including the dielectric substrates made of an organic material.
FIG. 4A
is an exploded perspective view and
FIG. 4B
is a schematic cross sectional view taken along the line denoted by PA of FIG.
4
A. Referring to
FIG. 4A
, the arrangement or a band-pass filter employs the two organic substrates
210
and
215
. The organic substrate
210
is a double-side printed circuit board of which the joining side (located opposite to the other dielectric substrate
215
) has conductor patterns
210
a
and
210
b
of a resonance circuit provided thereon. A shield coating
210
c
is provided on the other side of the organic substrate
210
. The other organic substrate
215
is a single-side printed circuit board of which the conductive side is covered with a shield coating
215
c.
As the conductor pattern
210
a
side of the double-side printed circuit-board
210
comes opposite to the other side of the single-side printed circuit board
215
where the shield coating
215
c
is not provided, a prepreg
218
for bonding is sandwiched between the double-side printed circuit board
210
and the single-side printed circuit board
215
. After pressing and heating the assembly, a step impedance resonance arrangement of the band-pass filter is completed.
The thickness of the double-side printed circuit board
210
or the single-side printed circuit board
215
can easily be controlled at high precision. However, the thickness of the prepreg
218
which is an adhesive dielectric layer for bonding the substrates may significantly be varied depending on the conditions of fabrication and the patterning rate of the printed circuit board and hardly be adjusted to a desired setting.
If the thickness of the prepreg
218
varies, a desired level of the filtering characteristic can rarely be obtained. As the yield of the band-pass filter is declined, the band-pass filter will be high in the cost even when its substrate materials are inexpensive.
SUMMARY OF THE INVENTION
It is thus an object of the present invention to provide a circuit device board, a semiconductor component, and a method of the same, of which the characteristic has a desired level with two or more dielectric substrates joined one another.
A circuit device board according to the present invention is provided by: joining a first dielectric substrate ha
Hirabayashi Takayuki
Okubora Akihiko
Shikichi Hideyuki
Paladini Albert W.
Sonnenschein Nath & Rosenthal
Sony Corporation
Vigushin John B.
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