Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate
2005-12-27
2008-08-26
Le, Thao X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
C257S678000, C257S730000, C257S773000, C257S787000, C257S676000, C257S737000, C257S778000, C257S666000, C257S795000, C257SE23001, C257SE23194, C438S124000, C438S127000, C438S106000, C438S064000, C438S055000
Reexamination Certificate
active
07417309
ABSTRACT:
To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first bonding pad, and a second bonding pad; and a semiconductor element (TR) attached to the conductive pattern. The circuit device further includes: a sealing resin for covering the semiconductor element (TR) and the conductive pattern with a rear surface of the conductive pattern being exposed; and a coating resin for covering the rear surface of the conductive pattern exposed from the sealing resin. The rear surface of the conductive pattern is exposed from openings of the coating resin, and the openings are arranged with rotational symmetry about a central point of the circuit device.
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Aoki Naoyuki
Ito Masami
Matsuki Hideo
Takahashi Kouji
Armand Marc-Anthony
Borodach Samuel
Fish & Richardson P.C.
Le Thao X.
Sanyo Electric Co,. Ltd.
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