Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-05-01
2009-06-30
Rogers, David A. (Department: 2856)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S067000, C439S077000, C361S748000, C361S749000
Reexamination Certificate
active
07553164
ABSTRACT:
A circuit device of the present invention includes a first element which is placed parallel to a first reference plane and which senses a physical quantity, and a second element placed parallel to a second reference plane which intersects the first reference plane at a predetermined angle. The circuit device further includes a sealing resin for integrally sealing the first and second elements, a first conductive pattern which is electrically connected to the first element and placed parallel to the first reference plane and which has a back surface exposed from the sealing resin, and a second conductive pattern which is electrically connected to the second element and placed parallel to the second reference plane and which has a back surface exposed from the sealing resin.
REFERENCES:
patent: 4891984 (1990-01-01), Fujii et al.
patent: 4947236 (1990-08-01), Suga et al.
patent: 5783748 (1998-07-01), Otani
patent: 6492698 (2002-12-01), Kim et al.
patent: 7071685 (2006-07-01), Saltsov et al.
patent: 7075794 (2006-07-01), Gall et al.
patent: 2003/0070483 (2003-04-01), Mueller
patent: 2004/0245997 (2004-12-01), Plotnikov et al.
patent: 2007/0101812 (2007-05-01), MacGugan
patent: 2004186460 (2004-07-01), None
patent: 2004-361175 (2004-12-01), None
patent: 2005129904 (2005-05-01), None
Inoue Yasunori
Mizuhara Hideki
Usui Ryosuke
Fish & Richardson P.C.
Rogers David A.
Sanyo Electric Co,. Ltd.
LandOfFree
Circuit device and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Circuit device and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit device and method of manufacturing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4074666