Circuit device and method of manufacturing the same

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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C439S067000, C439S077000, C361S748000, C361S749000

Reexamination Certificate

active

07553164

ABSTRACT:
A circuit device of the present invention includes a first element which is placed parallel to a first reference plane and which senses a physical quantity, and a second element placed parallel to a second reference plane which intersects the first reference plane at a predetermined angle. The circuit device further includes a sealing resin for integrally sealing the first and second elements, a first conductive pattern which is electrically connected to the first element and placed parallel to the first reference plane and which has a back surface exposed from the sealing resin, and a second conductive pattern which is electrically connected to the second element and placed parallel to the second reference plane and which has a back surface exposed from the sealing resin.

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patent: 5783748 (1998-07-01), Otani
patent: 6492698 (2002-12-01), Kim et al.
patent: 7071685 (2006-07-01), Saltsov et al.
patent: 7075794 (2006-07-01), Gall et al.
patent: 2003/0070483 (2003-04-01), Mueller
patent: 2004/0245997 (2004-12-01), Plotnikov et al.
patent: 2007/0101812 (2007-05-01), MacGugan
patent: 2004186460 (2004-07-01), None
patent: 2004-361175 (2004-12-01), None
patent: 2005129904 (2005-05-01), None

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