Circuit device and method of manufacturing the same

Details Circuit device and method of manufacturing the same Circuit device and method of manufacturing the same

2011-05-03

2011-05-03

Chen, Xiaoliang (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S705000, C361S779000, C361S306300, C029S846000, C029S832000, C257S621000, C257S706000, C257S778000, C257S780000, C438S209000, C438S612000, C438S615000, C438S720000

Reexamination Certificate

active

07936569

ABSTRACT:
In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small pad to which a chip component or a small signal transistor is fixed. In the present invention, a plated film made of nickel is formed on a surface of the first pad. Therefore, the first pad and a solder never come into contact with each other. Thus, a Cu/Sn alloy layer having poor soldering properties is not generated but a Ni/Sn alloy layer having excellent soldering properties is generated. Consequently, occurrence of sink in the melted solder is suppressed.

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