Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-05-03
2011-05-03
Chen, Xiaoliang (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S705000, C361S779000, C361S306300, C029S846000, C029S832000, C257S621000, C257S706000, C257S778000, C257S780000, C438S209000, C438S612000, C438S615000, C438S720000
Reexamination Certificate
active
07936569
ABSTRACT:
In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small pad to which a chip component or a small signal transistor is fixed. In the present invention, a plated film made of nickel is formed on a surface of the first pad. Therefore, the first pad and a solder never come into contact with each other. Thus, a Cu/Sn alloy layer having poor soldering properties is not generated but a Ni/Sn alloy layer having excellent soldering properties is generated. Consequently, occurrence of sink in the melted solder is suppressed.
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Korean Office Action, dated Dec. 11, 2007.
Chinese Office Action, dated Oct. 19, 2007.
Igarashi Yusuke
Nezu Motoichi
Sakamoto Noriaki
Takakusaki Sadamichi
Chen Xiaoliang
Sanyo Electric Co,. Ltd.
Westerman Hattori Daniels & Adrian LLP
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