Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2006-08-15
2006-08-15
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S686000, C257S787000, C257S784000, C257S737000, C257SE25011
Reexamination Certificate
active
07091606
ABSTRACT:
After a trench54is formed in a conductive foil60, the circuit elements are mounted, and the insulating resin is applied on the conductive foil60as the support substrate. After being inverted, the conductive foil60is polished on the insulating resin50as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths51and the circuit elements52are supported by the insulating resin50,without the use of the support substrate. And the interconnects L1to L3requisite for the circuit are formed, and can be prevented from slipping because of the curved structure59and a visor58.
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Kobayashi Yoshiyuki
Maehara Eiju
Mashimo Shigeaki
Okawa Katsumi
Sakamoto Junji
Fish & Richardson P.C.
Parekh Nitin
Sanyo Electric Co,. Ltd.
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