Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2008-07-29
2008-07-29
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S723000, C257S780000, C257S784000, C257S787000, C257SE23014, C257SE23079
Reexamination Certificate
active
07405486
ABSTRACT:
In stack packaging, an IC chip in an upper layer and an IC chip in a lower layer are insulated from each other by use of an insulating adhesive and the like. Thus, if an analog IC chip is stacked in the upper layer, a substrate is set in a floating state. Accordingly, there arises a problem that desired characteristics cannot be obtained. A conductive layer is disposed on an IC chip, and an analog IC chip is fixed on the conductive layer. The conductive layer is connected to a fixed potential pattern through a bonding wire and the like. Thus, a fixed potential can be applied to a rear surface (substrate) of the analog IC chip. Consequently, a mounting structure including the analog IC chip stacked in the upper layer can be realized. In addition, versatility of stack packaging for a circuit device including the analog IC chip can be improved, and a mounting area can be reduced. Moreover, characteristics can be improved.
REFERENCES:
patent: 6476331 (2002-11-01), Kim et al.
patent: 6576997 (2003-06-01), Uchida
patent: 6833287 (2004-12-01), Hur et al.
patent: 7034388 (2006-04-01), Yang et al.
patent: 2002/0096780 (2002-07-01), Chen et al.
patent: 2002/0140073 (2002-10-01), Pai et al.
patent: 11-354714 (1999-12-01), None
patent: 2002-368189 (2002-12-01), None
Clark Jasmine J
Fish & Richardson P.C.
Sanyo Electric Co,. Ltd.
LandOfFree
Circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2798923