Circuit device

Details Circuit device Circuit device

2011-06-07

2011-06-07

Levi, Dameon E (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000, C361S783000, C361S810000, C174S521000, C174S528000

Reexamination Certificate

active

07957158

ABSTRACT:
A circuit device having improved packaging density is provided. A circuit device of the present invention includes: a circuit board having its surface covered with an insulating layer; conductive patterns formed on a surface of the insulating layer; circuit elements electrically connected to the conductive patterns; and leads connected to pads formed of the conductive patterns. Furthermore, a control element is fixed to an upper surface of a land part formed of a part of a lead, and a back surface of the land part is spaced apart from an upper surface of the circuit board.

REFERENCES:
patent: 5289344 (1994-02-01), Gagnon et al.
patent: 5559374 (1996-09-01), Ohta et al.
patent: 5926372 (1999-07-01), Rinehart et al.
patent: 2005/0263880 (2005-12-01), Igarashi et al.
patent: 2005/0263905 (2005-12-01), Usul et al.
patent: 2006/0258055 (2006-11-01), Okamoto
patent: 2008/0290484 (2008-11-01), Low et al.
patent: 2640202 (2004-09-01), None
patent: 1705105 (2005-12-01), None
patent: 05-102645 (1993-04-01), None
Chinese Office Action dated Jun. 5, 2009 (1 page).

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