Circuit device

Details Circuit device Circuit device

2006-03-29

2008-11-18

Nguyen, Dao H (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S660000, C257S686000, C257S706000, C257SE23114, C257SE25013, C438S108000, C438S109000

Reexamination Certificate

active

07453153

ABSTRACT:
The ground noise is reduced which propagates between circuit elements in a circuit device having a multiple stack structure. A grounding bonding pad provided on the surface of a second circuit element is connected to a bonding wire provided on the surface of a conduction layer via a grounding wire such as gold. A bonding pad provided on the surface of the conductive layer is connected to a lead provided on a ground wire via a grounding wire such as gold. This structure creates a capacitance between the second circuit element and the conduction layer so as to prevent the propagation of noise circuit from element to the ground wiring.

REFERENCES:
patent: 6737750 (2004-05-01), Hoffman et al.
patent: 7205651 (2007-04-01), Do et al.
patent: 7245003 (2007-07-01), Li
patent: 2003/0020151 (2003-01-01), Chen et al.
patent: 09-186289 (1997-07-01), None
patent: 11-204720 (1999-07-01), None
patent: 2004-111656 (2004-04-01), None
Chinese Office Action, with English Translation, issued in Chinese Patent Application No. CN 200610089893.7, dated Mar. 7, 2008.
Japanese Office Action, with English Translation, issued in Japanese Patent Application No. JP 2006-075340, dated Apr. 22, 2008.

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