Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent
1996-05-09
1999-03-16
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
257704, 257710, 257723, 257797, 257779, H01L 2302, H01L 2312, H01L 2310, H01L 2334
Patent
active
058834257
ABSTRACT:
A circuit device, for example, a hybrid integrated circuit device, for improving the positioning accuracy of a frame element is disclosed. At least two thick film electrodes (7a) of circular configuration having a diameter of 0.3 mm or greater are formed on a component mounting surface (7S) of a thick film substrate (7) along outer wall peripheries (5OE) of a bottom surface (5B) of a frame element (5) bonded on the component mounting surface (7S) with an adhesive (6), and raised portions (4a) consisting essentially of solder are formed on the thick film electrodes (7a), respectively. The presence of the raised portions (4a) determines the position of the frame element (5) and prevents positional error of the frame element (5). The thick film electrodes (7a) may be of rectangular configuration which allows stabler positioning of the frame element (5). The thick film electrodes (7a) and raised portions (4a) may be formed along inner wall peripheries of the bottom surface (5B) of the frame element (5).
REFERENCES:
patent: 5151773 (1992-09-01), Matsui et al.
patent: 5276289 (1994-01-01), Satoh et al.
patent: 5570274 (1996-10-01), Saito et al.
Arroyo Teresa M.
Mitsubishi Denki & Kabushiki Kaisha
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