Circuit connection structure

Details Circuit connection structure Circuit connection structure

1997-03-21

2001-02-06

Parker, Kenneth (Department: 2871)

Liquid crystal cells, elements and systems

Particular structure

Having significant detail of cell structure only

Reexamination Certificate

active

06184965

ABSTRACT:

FIELD OF THE INVENTION AND RELATED ART
The present invention relates to an integrated circuit connection structure, and particularly to a tape carrier package (TCP) carrying an integrated circuit with an improved heat dissipation characteristic.
The tape-automated bonding (TAB) scheme using a tape carrier package (TCP) as a scheme of mounting an integrated circuit or integrated circuits on a substrate is being widely used for mounting ICs for thin electronic calculators and driver ICs for driving liquid crystal displays (LCDs), as representative examples. Recently, the TAB scheme has also been used for mounting of central processing units (CPUs).
Integrated circuit mounting structures including a driver IC mounted on a substrate may, for example, include a TCP loaded with an IC connected to a substrate for a power supply, etc.
Incidentally, for production of LCDs which have been enlarged in area and required to effect higher resolution display in recent years, it has been required to comply with increases in number and length of drive lines (scanning lines and data lines) on a display panel for LCDs, higher performances and an increase in the number of output electrodes (pins) for driver ICs as integrated circuits for LCDs, and narrower pitches of input and output lead patterns (conductor patterns) on TCPs. Along with such increases in drive performances and the number of output pins of driver ICs, an increased amount of heat is evolved during operation of a driver IC due to an increased drive load on the driver IC.
When such an increased amount of heat is evolved from driver ICs in an LCD, the evolved heat from the drive ICs is conducted to the liquid crystal panel via the TCP to generate a temperature distribution along the liquid crystal panel. As a result, a difference in picture display performance over the panel occurs.
In LCD designing at present, temperature distribution over a display panel has been made uniform by optimized disposition of surrounding units, such as a backlight, a driver controller, a power supply unit, etc. However, when a substantial amount of heat is conducted to the display panel from driver ICs disposed in proximity to the panel, it becomes difficult to realize a sufficiently uniform temperature distribution by such conventional optimized disposition of surrounding units. It is also difficult to achieve it by disposition of a heat radiation plate or a heat slinger.
On the other hand, a mounting technique using a TCP not only is used for mounting LCD driver ICs but also is gradually used for mounting general-purpose integrated circuits. Accordingly, even for a TCP mounted with a CPU, the heat evolution from an integrated circuit is becoming problematic along with the use of higher speed clock signals and narrower conductors for the integrated circuit. Incidentally, in the case of a known package structure, such as a quad flat package (QFP), it is possible to attach a heat radiating plate, but the attachment is difficult for a TCP in view of its structure.
SUMMARY OF THE INVENTION
In view of the above-mentioned problems, a principal object of the present invention is to provide an integrated circuit connection structure capable of effectively dissipating heat evolved in an integrated circuit and a tape carrier package.
According to the present invention, there is provided a tape carrier package structure, comprising:
a flexible film,
a semiconductor device mounted on the film,
a first conductor pattern formed on the film and connected to the semiconductor device for inputting signals to and/or outputting signals from the semiconductor device, and
a second conductor pattern formed in a region not provided with the first conductor pattern on the film in a state substantially free from signal supply to or from the semiconductor device.
According to another aspect of the present invention, there is provided a tape carrier package structure having two major surfaces, comprising:
a flexible film,
a semiconductor device mounted on the film, and
a first conductor pattern formed on the film and connected to the semiconductor device for inputting signals to and/or outputting signals from the semiconductor device,
wherein at least a portion of at least one of the two major surfaces has been subjected to blackening.
These and other objects, features and advantages of the present invention will become more apparent upon consideration of the following description of the preferred embodiments of the present invention taken in conjunction with the accompanying drawings, wherein like parts are denoted by like reference numerals.


REFERENCES:
patent: 5130832 (1992-07-01), Kawaguchi et al.
patent: 5146354 (1992-09-01), Plesinger
patent: 5283677 (1994-02-01), Sagawa et al.
patent: 5680191 (1997-10-01), Voisin et al.
patent: 5745202 (1998-04-01), Yamauchi et al.

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