Circuit connecting material, film-like circuit connecting...

Details Circuit connecting material, film-like circuit connecting... Circuit connecting material, film-like circuit connecting...

2004-06-24

2011-10-25

Silverman, Stanley (Department: 1736)

Stock material or miscellaneous articles

Composite

Of silicon containing

C428S3550RA, C428S356000, C428S469000, C428S403000, C428S213000, C252S500000, C252S512000, C174S259000, C174S260000, C257S783000, C257S784000, C156S325000, C156S273900, C156S274800

Reexamination Certificate

active

08043709

ABSTRACT:
The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

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