Circuit-connecting material and circuit terminal connected...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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C156S327000, C156S332000, C428S413000, C428S500000, C428S522000

Reexamination Certificate

active

07967943

ABSTRACT:
A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

REFERENCES:
patent: 4212959 (1980-07-01), Fukami et al.
patent: 4243462 (1981-01-01), Hori et al.
patent: 4607087 (1986-08-01), Moriya et al.
patent: 4735847 (1988-04-01), Fujiwara et al.
patent: 4735988 (1988-04-01), Takada et al.
patent: 4963974 (1990-10-01), Ushio et al.
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5096962 (1992-03-01), Holmes-Farley et al.
patent: 5120665 (1992-06-01), Tsukagoshi
patent: 5158818 (1992-10-01), Aurichio
patent: 5162087 (1992-11-01), Fukuzawa et al.
patent: 5183969 (1993-02-01), Odashima
patent: 5208266 (1993-05-01), Yamazaki
patent: 5395876 (1995-03-01), Frentzel et al.
patent: 5475048 (1995-12-01), Jamison et al.
patent: 5605763 (1997-02-01), Yusa et al.
patent: 5667899 (1997-09-01), Yusa et al.
patent: 6097100 (2000-08-01), Eguchi et al.
patent: 6124023 (2000-09-01), Furuta et al.
patent: 6762249 (2004-07-01), Fujinawa et al.
patent: 6777464 (2004-08-01), Watanabe et al.
patent: 6939913 (2005-09-01), Arifuku et al.
patent: 7141645 (2006-11-01), Fujinawa et al.
patent: 7241644 (2007-07-01), Arifuku et al.
patent: 7553890 (2009-06-01), Watanabe et al.
patent: 7604868 (2009-10-01), Watanabe et al.
patent: 7618713 (2009-11-01), Watanabe et al.
patent: 7629050 (2009-12-01), Watanabe et al.
patent: 7629056 (2009-12-01), Watanabe et al.
patent: 7776438 (2010-08-01), Tatsuzawa et al.
patent: 7777335 (2010-08-01), Arifuku et al.
patent: 7785708 (2010-08-01), Tatsuzawa et al.
patent: 2004/0222408 (2004-11-01), Watanabe et al.
patent: 2005/0151271 (2005-07-01), Tatsuzawa et al.
patent: 2005/0176882 (2005-08-01), Arifuku et al.
patent: 2006/0014860 (2006-01-01), Watanabe et al.
patent: 2006/0060969 (2006-03-01), Watanabe et al.
patent: 2006/0063366 (2006-03-01), Watanabe et al.
patent: 2006/0100314 (2006-05-01), Arifuku et al.
patent: 2006/0252843 (2006-11-01), Fujinawa et al.
patent: 2007/0299172 (2007-12-01), Watanabe et al.
patent: 2008/0054225 (2008-03-01), Watanabe et al.
patent: 2008/0057742 (2008-03-01), Watanabe et al.
patent: 2008/0064233 (2008-03-01), Watanabe et al.
patent: 2008/0064849 (2008-03-01), Tatsuzawa et al.
patent: 2010/0012358 (2010-01-01), Tatsuzawa et al.
patent: 0 372 880 (1989-12-01), None
patent: 0 488 561 (1992-06-01), None
patent: 0 995 784 (2000-04-01), None
patent: 50-126954 (1975-10-01), None
patent: 51-20941 (1976-02-01), None
patent: 52-090537 (1977-07-01), None
patent: 59-120436 (1984-07-01), None
patent: 59-159866 (1984-09-01), None
patent: 59-204613 (1984-11-01), None
patent: 59-221371 (1984-12-01), None
patent: 60-191228 (1985-09-01), None
patent: 60-262430 (1985-12-01), None
patent: 61-148277 (1986-07-01), None
patent: 61-194732 (1986-08-01), None
patent: 61-296077 (1986-12-01), None
patent: 62-141083 (1987-06-01), None
patent: 63-081187 (1988-04-01), None
patent: 63-083181 (1988-04-01), None
patent: 1-251787 (1989-10-01), None
patent: 3-29207 (1991-02-01), None
patent: 03-137121 (1991-06-01), None
patent: 4-174980 (1992-06-01), None
patent: 04-216884 (1992-08-01), None
patent: 04-275380 (1992-09-01), None
patent: 04-277585 (1992-10-01), None
patent: 05-339555 (1993-12-01), None
patent: 05-339556 (1993-12-01), None
patent: 05-347464 (1993-12-01), None
patent: 06-059268 (1994-04-01), None
patent: 6-145639 (1994-05-01), None
patent: 06-295617 (1994-10-01), None
patent: 07-073740 (1995-03-01), None
patent: 07-090236 (1995-04-01), None
patent: 7-90237 (1995-04-01), None
patent: 7-211145 (1995-08-01), None
patent: 07-326635 (1995-12-01), None
patent: 8-73832 (1996-03-01), None
patent: 08-111124 (1996-04-01), None
patent: 08-239641 (1996-09-01), None
patent: 08-239642 (1996-09-01), None
patent: 08-253739 (1996-10-01), None
patent: 08-315885 (1996-11-01), None
patent: 08-319461 (1996-12-01), None
patent: 08-325543 (1996-12-01), None
patent: 09-025394 (1997-01-01), None
patent: 9-55448 (1997-02-01), None
patent: 09-095652 (1997-04-01), None
patent: 09-118860 (1997-05-01), None
patent: 09-169958 (1997-06-01), None
patent: 09-176309 (1997-07-01), None
patent: 09-291259 (1997-11-01), None
patent: 10-273626 (1998-10-01), None
patent: 10-273630 (1998-10-01), None
patent: 10-330616 (1998-12-01), None
patent: 11-065112 (1999-03-01), None
patent: 11-065130 (1999-03-01), None
patent: 11-87415 (1999-03-01), None
patent: 11-279511 (1999-10-01), None
patent: 11-279513 (1999-10-01), None
patent: 11-329069 (1999-11-01), None
patent: 3048197 (2000-03-01), None
patent: 2001-68832 (2001-03-01), None
patent: 2001-323249 (2001-11-01), None
patent: 2002-285135 (2002-10-01), None
patent: 2003-027035 (2003-01-01), None
patent: 3477367 (2003-09-01), None
patent: 2004-128465 (2004-04-01), None
patent: 3587859 (2004-11-01), None
patent: 3877090 (2006-11-01), None
patent: 98/44067 (1998-10-01), None
patent: 01/14484 (2001-03-01), None
Machine Translation of JP 08-111124, provided by the JPO website (1996).
Calder et al. Ask a Scientist: Molecular Size and Solubility (2002) http://www.newton.dep.anl.gov/askasci/chem00/chem00888.htm.
Machine translation of JP 05-339556, provided by the JPO website (1993).
Office Action in co-pending U.S. Appl. No. 11/227,186, dated Apr. 18, 2007.
Office Action in corresponding Japanese application 2003-186397 issued on Jun. 19, 2007.
“Chemical Dictionary,” Morikita Publish. Inc., pp. 833-834, 1986.
Observations by Third Parties Under EPC Art. 115, 23 pages.
English Translation of JP 08-325543, prepared by the Japanese Patent Office, 2003, 12 pages.
ACS English Abstracts for JP 11-279511 and JP 11-279513, 2002.
Eurpoean Search Report, in EP 98 91 1125, May 22, 2000, 4 pages.
European Search Report, in EP 04 02 8659, Mar. 30, 2005, 3 pages.
Search Report issued in corresponding European Application No. 06115661.8, completed Sep. 8, 2006 and mailed Sep. 20, 2006.
Machine Translation of JP 08-253739 (1996), provided by the JPO website.
Office Action issued in parent U.S. Appl. No. 10/860,578 dated Nov. 27, 2008.
Office Action Issued in the Corresponding U.S. Appl. No. 11/227,186 Dated Jan. 2, 2008.
Osswald et al., Material Science of Polymers for Engineers, 1996, pp. 23-37.
Non Final Office Action Issued in the Corresponding U.S. Appl. No. 10/860,578 on Apr. 9, 2008.
Office Action issued in co-pending U.S. Appl. No. 11/841,532, dated Jan. 9, 2009.
Kirak, Arzu et al., “Dielectric properties and electric conductivity of talc and doped talc,” J. Phys. D: Appl Phys. 32, 1999, pp. 1919-1927.
Office Action issued in a counterpart European patent application No. 06115661.8, dated Oct. 8, 2008 (which cites Non-Patent Literature Document 3 above).
Office Action issued in a counterpart U.S. Appl. No. 10/860,578, dated Oct. 17, 2008 (which cited United States Patent Document 1 above).
Office Action issued in a counterpart U.S. Appl. No. 11/841,483, dated Dec. 24, 2008 (which cited United States Patent Documents 2-5 and Foreign Patent Document 4 above).
English translation of Office Action issued in Japanese application No. 2005-116147, issued Sep. 9, 2008.
English translation of Office Action issued in Japanese application No. 2005-116155, issued Oct. 21, 2008.
English translation of Office Action issued in Japanese application No. 2003-186397, issued Dec. 2, 2008.
English translation of Office Action issued in Japanese application No. 2005-116151, issued Mar. 24, 2009.
Office Action issued in related Japanese application 2005-116151, dated Dec. 1, 2009. No English translation available, submitted for certification date purposes.
Extended/Supplementary European Search Report issued in related

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