Circuit condition monitor with integrally molded test point sock

Details Circuit condition monitor with integrally molded test point sock Circuit condition monitor with integrally molded test point sock

1988-10-04

1990-02-27

Eisenzopf, Reinhard J.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

Nonquantitative

324522, 324156, 361372, 174 11BH, 340664, G01R 104, G01R 3100, H02G 1508

Patent

active

049049321

ABSTRACT:
A circuit condition monitoring system for an electrical power distribution system includes a system connector component having an integrally molded test point socket within which a circuit module is received to provide fault current or voltage loss monitoring of a system conductor within the connector. The test point socket provides capacitive coupling to the monitored conductor without the use of a metallic test point, and a ground return to the electrically conductive outer sheath of the connector. An electrically conductive end cap may be provided to cover the projecting end of the module when the module is installed in the socket. Adapters installed on the other end of the module enable the module to be installed on prior metallic contact-type test points.

REFERENCES:
patent: 3443158 (1969-05-01), Arndt
patent: 3513394 (1970-05-01), Tochick
patent: 3524133 (1970-08-01), Arndt
patent: 3657650 (1972-04-01), Arndt
patent: 3939412 (1976-02-01), Hermstein et al.
patent: 4152643 (1979-05-01), Schweitzer, Jr.
patent: 4234847 (1980-11-01), Schweitzer, Jr.
patent: 4251770 (1981-02-01), Schweitzer, Jr.
patent: 4263550 (1981-04-01), Schweitzer, Jr.

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