Circuit component mounting device

Details Circuit component mounting device Circuit component mounting device

2007-12-25

2007-12-25

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000

Reexamination Certificate

active

11231746

ABSTRACT:
A circuit component mounting device includes a resin substrate, vias, a circuit component composed of a main body and electrode portions, a solder, and an insulative sealing resin that covers the circuit component and the solder. The device further includes a base metal pattern which covers parts of the principal face of the resin substrate where the vias are exposed and is composed of a Cu layer and a Ni layer and a copper plated pattern which is provided on the base metal pattern and is composed of a Cu layer, a Ni layer, and an Au layer. The circuit component is provided on the copper plated pattern. The solder allows the copper plated pattern and the circuit component to adhere to each other.

REFERENCES:
patent: 6521997 (2003-02-01), Huang et al.
patent: 6674178 (2004-01-01), Ikegami
patent: 7094068 (2006-08-01), Huang et al.
patent: 2005/0011672 (2005-01-01), Alawani et al.
patent: 2004-103998 (2004-04-01), None

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