Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-06-07
2011-06-07
Dinh, Tuan T (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S757000, C361S736000, C174S254000
Reexamination Certificate
active
07957151
ABSTRACT:
An electrode connection structure including a first circuit component including a resin plate, a barrier film stacked on a surface of the resin plate, a circuit section formed on the barrier film and a first electrode provided on the surface of the resin plate on which the barrier film is stacked, and a second circuit component arranged to face the first circuit component and having a second electrode facing the first electrode, wherein the first and second electrodes are electrically connected via pressure applied thereto in the directions approaching each other and a portion of the barrier film surrounding the first electrode is at least partially removed from the surface of the resin plate.
REFERENCES:
patent: 5214346 (1993-05-01), Komatsu
patent: 5474834 (1995-12-01), Tanahashi et al.
patent: 6114864 (2000-09-01), Soejima et al.
patent: 6166333 (2000-12-01), Crumly et al.
patent: 2001/0040794 (2001-11-01), Shimizu et al.
patent: 2005/0017373 (2005-01-01), Nishikawa et al.
patent: 2005/0236623 (2005-10-01), Takechi et al.
patent: 2007/0176182 (2007-08-01), Wen et al.
patent: 1381888 (2002-11-01), None
patent: 9-199206 (1997-07-01), None
patent: 11-305259 (1999-11-01), None
patent: 2001-290136 (2001-10-01), None
patent: 2001-337340 (2001-12-01), None
patent: 2004-296917 (2004-10-01), None
patent: 2005-311205 (2005-11-01), None
Official communication issued in the International Application No. PCT/JP2006/321669, mailed on Jan. 23, 2007.
Aita Tetsuya
Chikama Yoshimasa
Dinh Tuan T
Keating & Bennett LLP
Sawyer Steven
Sharp Kabushiki Kaisha
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