Circuit component built-in module, radio device having the...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S832000, C029S840000

Reexamination Certificate

active

06931725

ABSTRACT:
A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in module100includes the insulating substrate101made of a first mixture105and a second mixture106, wiring patterns102aand102bformed on one principal surface and another principal surface of the insulating substrate101, a circuit component103aelectrically connected to the wiring pattern102aand sealed with the second mixture106in an internal portion of the insulating substrate101, the inner via conductor104electrically connecting the wiring pattern102aand102b.

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patent: 11-312868 (1999-11-01), None

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