Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2000-12-15
2003-03-25
Paladini, Albert W. (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S260000
Reexamination Certificate
active
06538210
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a circuit component built-in module and a method for producing the same. In particular, the present invention relates to a circuit component built-in module in which, for example, a circuit component is placed in an internal portion of an insulating substrate and a method for producing the same.
2. Related Background Art
In recent years, with the demand for high performance and miniaturization of electronic equipment, high density, high performance and short-distance wiring of a circuit component have been desired increasingly. Accordingly, a wiring substrate capable of including a high density, high-performance and short-distance wiring circuit component has been demanded. The formation of a multi-layer circuit may be a solution to attain a higher-density wiring substrate. However, a conventional glass-epoxy substrate requires a through-hole structure by using a drill, so that it is difficult to achieve a high density mounting. Therefore, as the most useful method for attaining a high density circuit, an inner-via-hole connection method that can connect wiring patterns between LSIs or circuit components in the shortest distance are being developed in various fields.
In the inner-via-hole connection method, only the necessary layers can be connected, and the mounting property of the circuit components is excellent (see JP63(1988)-47991A, JP6(1994)-268345A).
On the other hand, in a mounting method in which an active component such as a semiconductor chip is mounted on the surface layer of a wiring substrate, there is a limitation in attaining high density. Therefore, a mounting method of providing a substrate with a concave portion and mounting a semiconductor chip so as to be contained in the concave portion has been suggested (JP5(1993)-259372A, JP11(1999)-103147A, JP11(1999)-163249A). In this case, after the semiconductor chip is mounted in the concave portion, a sealing resin is coated so as to protect the connection portion and the semiconductor chip. Thus, sealing is performed.
However, since the substrate used in the conventional inner-via-hole connection method is formed of a resin material, it has a low thermal conductivity. Furthermore, in the circuit component built-in module, as the mounting density of the circuit substrate is higher, it is more necessary to release heat generated from the component. However, the conventional substrate cannot release heat sufficiently, thus deteriorating the reliability of the circuit component built-in module.
On the other hand, among the methods for building in a circuit component such as a semiconductor chip, in the method of providing the substrate with a concave portion so that the chip is placed therein and sealing with a sealing resin, it is necessary to perform many processes, for example, a process for forming a concave portion on the substrate, etc., which raise cost. Also, in such a method, incidence of defectiveness is increased. Furthermore, because a chip is built in, it is difficult to release heat around the chip effectively even though heat release is required. Furthermore, since the sealing resin is intervened, the property of the substrate does not have uniformity in three dimension.
If the circuit component such as a semiconductor, etc. is built in the substrate in the burying process, when the semiconductor chip is buried in the wiring pattern formed on the mold release body, a sheet flows radically and the location of the preliminarily formed via conductor may be distorted, or a wiring pattern around the chip may be disconnected or distorted. Therefore, this method has much difficulty in practice. Furthermore, there are many limitations in re-wiring in the chip built-in configuration.
Furthermore, when the mold release body is an organic film having a adhesive property, it is impossible to secure a sufficient gap for the connection portion between the wiring pattern and the semiconductor chip, and it is difficult to inject the sealing resin capable of sealing the connection portion, and thus the reliability of the connection portion cannot be obtained sufficiently.
On the other hand, in the module in which a circuit component is built in, since there is a difference in the coefficient of thermal expansion between the substrate and the circuit components, it is not possible to secure the reliability of the circuit component when the circuit component is buried.
It is an object of the present invention to provide a circuit component built-in module capable of mounting circuit components with high density, having a high heat releasing property and a high reliability and a method for producing the same.
In order to attain the above-mentioned object, the circuit component built-in module of the present invention includes an insulating substrate including a mixture of an inorganic filler and a thermosetting resin; a wiring pattern formed on at least one principal surface of the insulating substrate; and a circuit component placed in an internal portion of the insulating substrate and electrically connected to the wiring pattern; and the mixture includes a second mixture that seals at least a connection portion between the wiring pattern and the circuit component and a first mixture forming a region excluding the second mixture in the insulating substrate. In this configuration, the amount of an inorganic filler contained in the first mixture is larger than the amount of the inorganic filler contained in the second mixture.
According to the configuration of the circuit component built-in module, heat generated from the circuit component is released by the inorganic filler swiftly, so that a circuit module having high reliability can be realized. Furthermore, among the two kinds of mixtures forming the insulating substrate, the second mixture having a smaller content of an inorganic filler seals the wiring portion connecting to the circuit component, so that a highly reliable connection portion free from the disconnection can be obtained.
Furthermore, by selecting the inorganic filler, it is possible to change the thermal conductivity, coefficient of linear thermal expansion, dielectric constant, breakdown voltage or the like. Therefore, since it is possible to make the coefficient of linear thermal expansion of the insulating substrate substantially the same as that of the semiconductor device, a circuit component built-in module preferably integrates a semiconductor device. Furthermore, since it is possible to improve the thermal conductivity of the insulating substrate, the circuit component built-in module preferably includes a semiconductor device requiring the heat release. Furthermore, since it is possible to lower the dielectric constant of the insulating substrate, a circuit component built-in module for high frequency is preferably provided.
Furthermore, in the case of a circuit component built in module including a semiconductor and a chip capacitor as the circuit components, it is possible to reduce the noise of the electric signal by shortening the distance between the semiconductor chip and the chip capacitor. Furthermore, it is preferable that the wiring patterns are formed on both principal surfaces of the insulating substrate, and an inner via conductor for electrically connecting the wiring patterns on both principal surfaces is provided.
Furthermore, in general, the semiconductor chip has a problem in terms of KGD (known good die) and handling, raising the cost. However, with the circuit component built-in module of the present invention, even if the bare semiconductor chip is used as the circuit component, it is advantageous in that the quality check is carried out easily. Furthermore, re-wiring is performed easily, so that it is possible to attain various LGA electrodes having less restriction in designing.
Furthermore, it is preferable in the circuit component built-in module of the present invention that the second mixture is intervened in the boundary portion between the wiring pattern and the first mixture.
Asahi Toshiyuki
Hirano Koichi
Matsuoka Yasuyuki
Nakatani Seiichi
Sugaya Yasuhiro
Matsushita Electric - Industrial Co., Ltd.
Merchant & Gould P.C.
Norris Geremy
Paladini Albert W.
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