Circuit component built-in module and method for producing the s

Details Circuit component built-in module and method for producing the s Circuit component built-in module and method for producing the s

1998-11-20

2000-03-14

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361761, 361764, 361762, 361750, 361751, 257700, 257687, 257642, 257635, 257773, 257774, 257778, 174255, 174256, 174260, 428901, 428206, 428209, H05K 103

Patent

active

060381337

ABSTRACT:
A circuit component built-in module of the present invention includes an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least a principal plane of the insulating substrate, a circuit component arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns, and an inner via formed in the insulating substrate for electrically connecting the plurality of wiring patterns. Thus, a highly reliable circuit component built-in module having high-density circuit components can be obtained.

REFERENCES:
patent: 4299873 (1981-11-01), Ogihara et al.
patent: 4417297 (1983-11-01), Oyama et al.
patent: 4800459 (1989-01-01), Taklagi et al.
patent: 5045381 (1991-09-01), Suzuki et al.
patent: 5153987 (1992-10-01), Takahashi et al.
patent: 5324687 (1994-06-01), Wojnarowski
patent: 5401688 (1995-03-01), Yamaji et al.
patent: 5401913 (1995-03-01), Gerber et al.
patent: 5412538 (1995-05-01), Kikinis et al.
patent: 5481795 (1996-01-01), Hatakeyama et al.
patent: 5484647 (1996-01-01), Nakatani et al.
patent: 5651179 (1997-07-01), Bessho et al.
patent: 5652042 (1997-07-01), Kawakita et al.
patent: 5677045 (1997-10-01), Nagai et al.
patent: 5806177 (1998-09-01), Hosomi et al.
patent: 5888627 (1999-03-01), Nakatani
patent: 5939782 (1999-08-01), Malladi

Affiliated with

Also associated with

Rating

Circuit component built-in module and method for producing the s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit component built-in module and method for producing the s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit component built-in module and method for producing the s will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-175549