Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2000-01-18
2002-01-15
Mayes, Curtis (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S230000, C156S235000, C156S298000, C156S307100, C156S307700, C361S760000, C428S901000
Reexamination Certificate
active
06338767
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a circuit component built-in module. In particular, the present invention relates to a circuit component built-in module in which, for example, an active component is arranged in an internal portion of an insulating substrate.
2. Description of the Prior Art
Recently, with a demand for high performance and miniaturization of electronic equipment, high-performance and high-density circuit components have been increasingly desired. This leads to a demand for a circuit substrate commensurate with high-performance and high-density circuit components.
The formation of a multilayered circuit may be a solution to achieve higher-density circuit components. However, a conventional glass-epoxy substrate requires a through-hole structure to form a multilayered circuit, to that is hardly a solution for high-density mounting. Therefore, a connection method using inner via holes that can connect between wiring patterns of LSIs or circuit components in the shortest distance has been developed in various fields in order to achieve higher density packaging.
The connection method using inner via holes allows electrical connection only between the layers necessary to be connected through a connection called an inner via, so that circuit components can be mounted with high density (U.S. Pat. Nos. 5,481,795, 5,484,647, and 5,652,042)
However, a substrate that has been conventionally used in the inner via connection comprises a resin based material, which has low thermal conductivity. Therefore, the problem of a low thermal conductivity is posed. In a circuit component built-in module, the higher density mounting of circuit components leads to an increased demand for releasing heat that has been generated in the components. However, the conventional substrate cannot sufficiently release heat, and therefore, the reliability of the circuit component built-in module deteriorates.
SUMMARY OF THE INVENTION
It is the object of the present invention to provide a highly reliable circuit component built-in module in which circuit components are mounted with high density, and a method for producing the same.
A first circuit component built-in module of the present invention includes an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % (on the basis of the mixture) of an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed on at least a principal plane of the insulating substrate (one wiring pattern consists of a group of electric lines formed on the same plane); a circuit component arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns; and an inner via formed in the insulating substrate for electrically connecting the plurality of wiring patterns.
The first circuit component built-in module allows circuit components to be mounted with high density, because the inner via formed in the insulating substrate establishes inner-via-hole connection.
Furthermore, the first circuit component built-in module allows circuit components to be mounted with further higher density by mounting circuit components on the wiring patterns formed in an internal portion of the insulating substrate.
Furthermore, the first circuit component built-in module constitutes a highly reliable circuit component built-in module, because heat generated in the circuit components is released promptly by the inorganic filler.
Furthermore, the first circuit component built-in module allows the heat conductivity, the coefficient of linear expansion, the dielectric constant, the breakdown voltage or the like of the insulating substrate to be changed in accordance with the circuit components by selecting a suitable inorganic filler. When the circuit component built-in module includes a semiconductor device and a chip capacitor, noise in electric signals can be reduced by reducing the distance between the semiconductor device and the chip capacitor.
In one embodiment of the first circuit component built-in module, the wiring patterns are preferably formed on the principal plane and in an internal portion of the insulating substrate. Mounting circuit components on the wiring patterns formed in an internal portion of the insulating substrate further increases the density in the circuit components.
In one embodiment of the first circuit component built-in module, the circuit component preferably includes an active component, and the inner via is preferably formed of a conductive resin composition. A circuit component having a desired function can be formed by including an active component in the circuit components. When the inner via is formed of a conductive resin composition, the production of the circuit component built-in module can be facilitated.
In one embodiment of the first circuit component built-in module, the circuit component is preferably shielded from external air by the insulating substrate. Shielding circuit components from external air prevents the reliability of the circuit components from deteriorating, which otherwise might deteriorate due to humidity.
In one embodiment of the first circuit component built-in module, the thermosetting resin preferably comprises at least one thermosetting resin selected from the group consisting of an epoxy resin, a phenol resin and a cyanate resin. These resins are excellent in heat resistance and electrical insulation.
In one embodiment of the first circuit component built-in module, the inorganic filler comprises at least one inorganic filler selected from the group consisting of Al
2
O
3
, MgO, BN, AlN and SiO
2
. Use of these inorganic filler provides an insulating substrate having an excellent heat dissipation. When MgO is used for the inorganic filler, the coefficient of linear expansion of the insulating substrate can be raised. When SiO
2
(especially, amorphous SiO
2
) is used for the inorganic filler, the dielectric constant of the insulating substrate can be reduced. When BN is used for the inorganic filler, the coefficient of linear expansion of the insulating substrate can be reduced.
In one embodiment of the first circuit component built-in module, an average particle diameter of the inorganic filler is preferably 0.1 &mgr;m to 100 &mgr;m.
In one embodiment of the first circuit component built-in module, the wiring patterns preferably comprise at least one conductive substance selected from the group consisting of copper and a conductive resin composition. Since copper has a small electrical resistance, fine wiring patterns can be formed by using copper. Furthermore, electric lines can be formed easily by using a conductive resin composition.
In one embodiment of the first circuit component built-in module, the wiring patterns preferably comprise lead frames formed by etching or stamping. The metal lead frame has a low electric resistance. Etching allows the formation of fine wiring patterns. Stamping allows formation of the wiring patterns with simple equipment.
In one embodiment of the first circuit component built-in module, the circuit component preferably comprises at least one component selected from the group consisting of a chip resistor, a chip capacitor and a chip inductor. A chip component can be readily buried in the insulating substrate.
In one embodiment of the first circuit component built-in module, preferably, the mixture further comprises at least one additive selected from the group consisting of a dispersant, a coloring agent, a coupling agent and a releasing agent. A dispersant serves to disperse the inorganic filler in the thermosetting resin uniformly and sufficiently. A coloring agent serves to color the insulating substrate, so that the heat dissipation of the circuit component built-in module can be improved. A coupling agent serves to raise the adhesion between the thermosetting resin and the inorganic filler, so that the insulating property of the insulating substrate can be improved. A releasing agent serves to improve the releasing property of the mold and the mixtu
Hirano Kouichi
Nakatani Seiichi
Mayes Curtis
Morrison & Foerster / LLP
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