Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1990-06-27
1992-03-17
Thompson, Gregory D.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
165 804, 165185, 174 152, 357 81, 361388, H05K 720
Patent
active
050973878
ABSTRACT:
A circuit chip package and method for assembling the same is disclosed which employs low eutectic or melting point solder, such as an indium alloy, as a thermally conductive medium between each circuit chip and the package cover. The melting point of the solder is selected above the highest normal operating temperature of the chips but below a temperature which would damage the chips or their interconnects. To assemble the package, the housing cover, which has one or more solder receptacles formed therein, is inverted and partially filled with liquid solder. A base containing the circuit chips and interconnects is then attached to the cover so that the top portions of the chips or extensions on the chips are partially dipped into the solder. The solder is then allowed to cool and solidify and thereby automaticaly accommodates for chip to housing dimensional variations. The package can be easily disassembled by passing warm fluid over the package to cause the solder to reliquify.
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Digital Equipment Corporation
Thompson Gregory D.
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