Circuit chip

Details Circuit chip Circuit chip

1984-12-10

1986-04-15

Albritton, Clarence L.

Electric heating

Heating devices

Combined with diverse-type art device

219 85CM, 219 85R, 2281802, H01L 2158, B23K 3102

Patent

active

045829756

ABSTRACT:
Disclosed is a method for removing a hybrid or integrated circuit chip soldered to a support structure. An electrical energy source is applied to the hybrid circuit chip for raising the temperature of the circuit chip sufficiently so as to melt the solderable material which interconnects the chip to the support structure. When the solderable material is melted, the circuit chip may then be removed from the support structure.

REFERENCES:
patent: 3289046 (1966-11-01), Carr
patent: 3499218 (1970-03-01), Dahlgren
patent: 3582610 (1971-06-01), Eckles
patent: 3660632 (1972-05-01), Leinkram

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