Circuit carrier and package structure thereof

Details Circuit carrier and package structure thereof Circuit carrier and package structure thereof

2004-04-02

2008-12-16

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S050510, C361S767000

Reexamination Certificate

active

07465885

ABSTRACT:
A circuit carrier is provided. The circuit carrier includes a substrate, a patterned circuit layer, and a solder mask layer. The patterned circuit layer is deposed on a surface of the substrate and has two passive component electrode pads. The solder mask layer covers the surface of the substrate, and includes a first solder mask opening, a second solder mask opening, and a third solder mask opening. The first solder mask opening and the second solder mask opening expose the passive component electrode pads respectively. The third solder mask opening along its length direction is divided into a central area and two extension areas. The central area is between the first and the second solder mask openings. The extension areas are extending from the central area along the length direction to two sides, respectively. The width of the central area is smaller than the width of one the extension areas.

REFERENCES:
patent: 5163605 (1992-11-01), Mencik et al.
patent: 5378859 (1995-01-01), Shirasaki et al.
patent: 6521997 (2003-02-01), Huang et al.
patent: 6673690 (2004-01-01), Chuang et al.

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