Refrigeration – Structural installation – With electrical component cooling
Patent
1993-02-26
1994-03-01
Bennet, Henry A.
Refrigeration
Structural installation
With electrical component cooling
165 804, 16510433, 361699, 361701, F28D 1500, H05H 720
Patent
active
052896943
ABSTRACT:
An assembly for mounting circuit cards having high power electrical and optical alloy MCM chip devices installed thereon. The assembly has a central vertical coolant supply pipe extending from a pump to a heat exchanger unit through a refrigeration unit separated from the heat exchanger unit by circuit board mounting shelves equipped with electrical and optical backplane apparatus interconnecting circuit cards mounted in the mounting shelves. The heat exchanger unit has radiator fins separated by vanes extended outward from a hub of the unit and is interconnected by return pipes extending through the circuit card mounting shelves and terminated in the refrigeration unit which is connected by a return pipe to the pump. Vent pipes connected with the heat exchanger vanes extend from the heat exchanger unit into circuit card mounting shelves in engagement with mounted circuit cards to transfer heat generated by the engaged circuit cards to the heat exchanger unit. The vent pipes are displaced to engage heat exchanger connectors terminating the vent pipes with circuit card heat sinks when the circuit cards are installed in the mounting shelf to effect a transfer of heat generated by the mounted circuit cards to the heat exchanger unit.
REFERENCES:
patent: 3504268 (1970-03-01), Hoffmann et al.
patent: 3952797 (1976-04-01), Voboril et al.
patent: 4449576 (1984-05-01), Baum et al.
patent: 4514746 (1985-04-01), Lundqvist
patent: 4646202 (1987-02-01), Hook et al.
patent: 4793405 (1988-12-01), Diggelmann et al.
patent: 5063475 (1991-11-01), Balan
AT&T Bell Laboratories
Bennet Henry A.
Doerrler William C.
Marshall Dwight A.
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