Circuit card having a large module strain relief and heat sink s

Details Circuit card having a large module strain relief and heat sink s Circuit card having a large module strain relief and heat sink s

1995-05-12

1996-09-17

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361773, 439487, H05K 770

Patent

active

055575030

ABSTRACT:
A circuit card having module strain relief and heat sink support is provided. The circuit card comprises a printed circuit board having a front and a back, a module mounted to the front of the printed circuit board, and a stiffening structure mounted to the back of the printed circuit card directly opposite from the module to provide rigidity to the printed circuit board. The module has a plurality of electrical leads making electrical connection with the printed circuit board and anchoring the module to the printed circuit board. The stiffening structure is coextensive with the plurality of electrical leads along the printed circuit board, and is of sufficient thickness and strength to resist flexure of an area of the printed circuit board in contact with the stiffening structure in response to shock and vibration applied to the module.

REFERENCES:
patent: 3911327 (1975-10-01), Murari et al.
patent: 4498120 (1985-02-01), Kaufman
patent: 4665467 (1987-05-01), Speraw et al.
patent: 4679118 (1987-07-01), Johnson et al.
patent: 4853828 (1989-08-01), Penn
patent: 4878108 (1989-10-01), Phelps, Jr. et al.
patent: 5141829 (1992-08-01), Dumas
patent: 5155661 (1992-10-01), Nagesh et al.
patent: 5182632 (1993-01-01), Bechtel
patent: 5184211 (1993-02-01), Fox
patent: 5268815 (1993-12-01), Cipolla et al.
patent: 5280411 (1994-01-01), Dirks
patent: 5305185 (1994-04-01), Samarov et al.
patent: 5426405 (1992-06-01), Miller
patent: 5468917 (1995-11-01), Brodsky

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