Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1989-05-02
1991-01-15
Nimmo, Morris H.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174262, 361401, H05K 100
Patent
active
049856014
ABSTRACT:
Circuit boards with imbedded traces, which may form grooves or trenches are provided. The traces may be at least partially filled with a reflowable conductive material such as solder. The grooves may be selectively furnished with solder while other regions may be empty or void of solder. In assembling electronic components, with or without extended leads, such as surface mount integrated circuits or chips, to the solder core circuit boards, the leads may be placed within the regions of the grooves without solder (contact regions) and then the circuit board may be heated selectively or as a whole to reflow the solder to the bonding or contacting regions to bond the traces to the leads upon cooling. Circuit boards having surface mount devices on both sides may be formed in this manner. Further, tape automated bonded or TAB mounted devices may be directly placed into and bonded to the traces or solder core circuit boards with minimum exposure of the excised TAB leads prior to assembly. In one form, the grooves are plated with copper before they are filled with solder.
REFERENCES:
patent: H487 (1988-07-01), Clark et al.
patent: 2600343 (1952-06-01), Tuttle
patent: 2692190 (1954-10-01), Pritikin
patent: 2695351 (1954-11-01), Beck
patent: 2848359 (1958-08-01), Talmey
patent: 2874085 (1959-02-01), Brietzke
patent: 2981868 (1961-04-01), Severson
patent: 3010863 (1961-11-01), Coe et al.
patent: 3247573 (1966-04-01), Noack
patent: 3528048 (1970-09-01), Kirk
patent: 3616014 (1971-10-01), Weglin
patent: 3729819 (1973-05-01), Horie
patent: 3778530 (1973-12-01), Reimann
patent: 3800020 (1974-03-01), Parfet
patent: 3835531 (1974-09-01), Luttmer
patent: 4024629 (1977-05-01), Lemoine et al.
patent: 4080513 (1978-03-01), Cuneo et al.
patent: 4301192 (1981-11-01), Plichta et al.
patent: 4345300 (1982-08-01), Stuckey
patent: 4354895 (1982-10-01), Ellis
patent: 4363930 (1982-12-01), Hoffman
patent: 4374457 (1983-02-01), Wiech, Jr.
patent: 4402135 (1983-09-01), Schweingruber et al.
patent: 4521449 (1985-06-01), Arnold et al.
patent: 4532152 (1985-07-01), Elarde
patent: 4604678 (1986-08-01), Hagner
patent: 4606787 (1986-08-01), Pelligrino
patent: 4614837 (1986-09-01), Kane et al.
patent: 4630096 (1986-12-01), Dry et al.
patent: 4635093 (1987-01-01), Ross
patent: 4651417 (1987-03-01), Schumacher, III et al.
patent: 4707394 (1987-11-01), Chant
patent: 4756929 (1988-07-01), Sullivan
patent: 4766268 (1988-08-01), Uggowitzer
patent: 4775611 (1988-12-01), Sullivan
patent: 4825539 (1989-05-01), Nagashima et al.
patent: 4841099 (1989-06-01), Epstein et al.
patent: 4851613 (1989-07-01), Jacques
K. S. Desai, et al., "Screen Printing on Indented Ceramic Green Sheets," IBM Tech. Discl. Bulletin, vol. 16, No. 11, Apr. 1974, p. 3561.
M. M. Haddad, et al., "Mechanically Bonded Printed Circuit," IBM Technical Disclosure Bulletin, vol. 2, No. 1, Jun. 1959, p. 9.
Keys Jerry M.
Mossman David L.
Nimmo Morris H.
LandOfFree
Circuit boards with recessed traces does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Circuit boards with recessed traces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit boards with recessed traces will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-56576