Electricity: electrical systems and devices – Miscellaneous
Patent
1980-05-27
1983-07-19
Kucia, Richard R.
Electricity: electrical systems and devices
Miscellaneous
174 685, 361400, H05K 118
Patent
active
043947115
ABSTRACT:
A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region of the printed circuit board includes at least two plated-through holes plated by a solderable material such as copper which also interconnects the holes, and a pin of weldable but solder-rejecting material such as stainless steel which lies in one of the holes and is in press fit contact with the walls of the hole. Component leads can be soldered into the pinless holes as by wave soldering techniques, without coating the pins with solder, and wires can be welded to the pins by stitch wire techniques. The pins permit wire welds to be made thereto without requiring large weld currents to pass through the thin plating layer of the board, and also facilitate repair of a damaged weld by replacement of the pin.
REFERENCES:
patent: 3238421 (1966-03-01), Patrick
patent: 3346689 (1967-10-01), Parstorpfer
patent: 3784965 (1974-01-01), Murphy
patent: 3786172 (1974-01-01), Conley
patent: 3912852 (1975-10-01), Simon
patent: 3917984 (1975-11-01), Kong
patent: 4110904 (1978-09-01), Johnson
George Mesner, Multilayer Printed Circuits, Int. Electronic Packaging Symposium, U. of Colo., Boulder, Colo., Aug. 1953, pp. 9 to 11.
D. H. Apgar, Folded Beam-Type Connector, IBM Tech. Dis. Bull., vol. 12 #6, pp. 775 & 776.
R. Cechanek, Multilayer Printed-Circuit Boards, IBM Tech. Dis. Bull., vol. 20 #11B, Apr. 1978, pp. 4726 7 4727.
Interconnection Technology, Inc.
Kucia Richard R.
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