Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2005-07-05
2005-07-05
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S758000, C361S792000, C174S255000
Reexamination Certificate
active
06914334
ABSTRACT:
Trace configurations for carrying high-speed digital differential signals provide for reduced conduction loss and improved signal integrity. In one embodiment, a circuit board has a first set of conductive traces disposed on non-conductive material, and a second set of conductive traces parallel to the first set and disposed within the conductive material. The second set is separated from the first set by non-conductive material. Corresponding traces of the first and second sets may be in a stacked configuration. In other embodiments, conductive material may be provided between corresponding traces of the first and second sets resulting in an “I-shaped” or “U-shaped” cross-section. In yet other embodiments, the trace configurations have “T-shaped” and “L-shaped” cross-sections.
REFERENCES:
patent: 4712161 (1987-12-01), Pryor et al.
patent: 5408053 (1995-04-01), Young
patent: 6292153 (2001-09-01), Aiello et al.
Figueroa David G.
He Jiangqi
Li Yuan-Liang
Zhong Dong
Andújar Leonardo
Flynn Nathan J.
Intel Corporation
Schwegman Lundberg Woessner & Kluth P.A.
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