Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1997-06-03
2000-12-19
Gaffin, Jeffrey
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
361760, 361767, 361768, 361777, 361783, H01B 700
Patent
active
061629979
ABSTRACT:
A circuit board is provided which has contacts on the surface arrayed to engage contact pads on a chip carrier bounded by a grid. A plurality of primary through holes are provided in the circuit board location within the grid and electrically connected to chip contact pads thereabove. A plurality of secondary through holes are provided which are located outside the grid and electrically connected to the inside of the chip contact pads. The spacing of the contacts on top of the board is less than the spacing of the contacts on the bottom.
REFERENCES:
patent: 4202007 (1980-05-01), Dougherty et al.
patent: 4598167 (1986-07-01), Ushifusa et al.
patent: 4912603 (1990-03-01), Seyama
patent: 4927983 (1990-05-01), Jones et al.
patent: 5001605 (1991-03-01), Savagian et al.
patent: 5097593 (1992-03-01), Jones et al.
patent: 5264325 (1993-11-01), Allen et al.
patent: 5424492 (1995-06-01), Petty et al.
patent: 5439766 (1995-08-01), Day et al.
patent: 5451721 (1995-09-01), Tsukada et al.
patent: 5477933 (1995-12-01), Nguyen
patent: 5487218 (1996-01-01), Bhatt et al.
patent: 5490040 (1996-02-01), Gaudenzi et al
Cuneo Kamand
Daugherty Patrick J.
Gaffin Jeffrey
International Business Machines - Corporation
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