Circuit board with organic dielectric layer

Details Circuit board with organic dielectric layer Circuit board with organic dielectric layer

2008-03-25

2008-03-25

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C174S262000

Reexamination Certificate

active

11003956

ABSTRACT:
Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as an organic polymer or an organic polymer mixture. Embodiments of the present invention also include forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and providing an embedded capacitor to reduce loop inductance.

REFERENCES:
patent: 3740678 (1973-06-01), Hill
patent: 4170819 (1979-10-01), Peter et al.
patent: 5212283 (1993-05-01), St. Clair
patent: 5421083 (1995-06-01), Suppelsa et al.
patent: 5601684 (1997-02-01), Shiga
patent: 5614765 (1997-03-01), Avanzino et al.
patent: 5689091 (1997-11-01), Hamzehdoost et al.
patent: 5741721 (1998-04-01), Stevens
patent: 5774336 (1998-06-01), Larson
patent: 5838549 (1998-11-01), Nagata et al.
patent: 5880018 (1999-03-01), Boeck et al.
patent: 5949030 (1999-09-01), Fasano et al.
patent: 6096411 (2000-08-01), Nakatani et al.
patent: 6124626 (2000-09-01), Sandhu et al.
patent: 6278153 (2001-08-01), Kikuchi et al.
patent: 6538300 (2003-03-01), Goldberger et al.
patent: 6829133 (2004-12-01), Wermer et al.
patent: 410283841 (1998-10-01), None
Nelms, D. , et al., “Anodization for Forming Thin Film Embedded Capacitors in MCM-D and MCM-L Substrates”,Proceedings of the 48th Electronic Components&Technology Conference, Seattle, WA,(May 1998),pp. 247-251.
Nishitsuji, M. , et al., “Advanced GaAs-MMIC Process Technology Using High-Dielectric Constant Thin Film Capacitors by Low-Temperature RF Sputtering Method”,15th Annual GaAs IC Symposium, Technical Digest, (Oct. 1993),pp. 329-332.
Stauf, G. T., et al., “Thin Film High K Dielectrics for Integrated Passive Devices”,The International Journal of Microcircuits&Electronic Packaging, 20 (2), (1997),pp. 75-80.

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