Circuit board with identifiable information and method for...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

Reexamination Certificate

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Reexamination Certificate

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08070932

ABSTRACT:
A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.

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patent: 4652734 (1987-03-01), Hubel
patent: 5952241 (1999-09-01), Baker et al.
patent: 6602734 (2003-08-01), Wada et al.
patent: 6835318 (2004-12-01), Suzuki et al.
patent: 6855626 (2005-02-01), Sato et al.
patent: 6861764 (2005-03-01), Sato et al.
patent: 7178229 (2007-02-01), Borland et al.
patent: 2002/0029486 (2002-03-01), Uchiyama et al.
patent: 2003/0015342 (2003-01-01), Sakamoto et al.
patent: 2003/0062192 (2003-04-01), Pearson et al.
patent: 2004/0129450 (2004-07-01), Yamazaki et al.
patent: 2004/0214006 (2004-10-01), Hirayama et al.
patent: 2003046243 (2003-02-01), None

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