Circuit board with high heat dissipations characteristic

Details Circuit board with high heat dissipations characteristic Circuit board with high heat dissipations characteristic

1990-06-19

1992-01-14

Tolin, Gerald P.

Electricity: electrical systems and devices

Miscellaneous

174255, 361388, 361414, H05K 720

Patent

active

050815628

ABSTRACT:
A circuit board includes a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.

REFERENCES:
patent: 2923860 (1960-02-01), Miller
patent: 3417294 (1968-12-01), Steidlitz
patent: 4410927 (1983-10-01), Butt
patent: 4544989 (1985-10-01), Nakabu
patent: 4630174 (1986-12-01), Stenerson
patent: 4731700 (1988-03-01), Woodward
patent: 4737395 (1988-04-01), Mabuchi
patent: 4755417 (1988-07-01), Detoma
patent: 4849284 (1989-07-01), Arthur

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