Circuit board with embedded passive component and...

Details Circuit board with embedded passive component and... Circuit board with embedded passive component and...

2007-01-24

2010-06-08

Levi, Dameon E (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000, C361S763000, C361S766000, C361S298200, C361S298400, C174S255000

Reexamination Certificate

active

07733662

ABSTRACT:
A process for fabricating a circuit board with an embedded passive component is provided. First, an electrode-patterned layer having electrodes is formed on a surface of a conductive layer. Then, a passive component material is filled in the intervals between the electrodes. Then, the conductive layer and the electrode-patterned layer are laminated to a dielectric layer, wherein the electrode-patterned layer is embedded in the dielectric layer. Next, the conductive layer is patterned to form a circuit layer.

REFERENCES:
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patent: 6706975 (2004-03-01), Sumi et al.
patent: 6884313 (2005-04-01), Liu et al.
patent: 2002/0185303 (2002-12-01), Takeuchi et al.
patent: 2002/0195270 (2002-12-01), Okubora et al.
patent: 2004/0118600 (2004-06-01), Lee et al.
patent: 2005/0013087 (2005-01-01), Wu et al.

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