Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-07-15
1995-05-30
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361748, 361760, 174260, H05K 118
Patent
active
054207550
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a circuit board with electrical components in which the components are inserted with their insulated component bodies into through-bores of the circuit board, slightly protruding from the underside of the circuit board and the top of the circuit board and having contact surfaces in these areas which are soldered to strip conductors. The lower ends of the components terminate in the shape of hemispherical cups or rounded conical tips and have appropriate lower contact surfaces protruding into the strip conductors, embodied as lands, and are soldered to them.
2. Description of Prior Art
A circuit board of this type is taught by German Patent Reference DE 31 15 303 and U.S. Pat. No. 4,878,155. In accordance with the teachings of these references, each component is embodied as an individual element, such as a resistor, capacitor, diode or the like, so that it is not possible to attain a high component density of the components on the circuit board.
SUMMARY OF THE INVENTION
It is an object of this invention to provide a circuit board of the type discussed above wherein the component configurations permit, along with rapid and automatic assembly and soldering, a considerably increased component density.
This object is achieved in accordance with one embodiment of this invention where the upper ends of the components have a plurality of upper contact surfaces which are insulated from each other and which are connected to contact elements protruding from the component body. The contact elements are connected at a distance around the bores of the circuit board to strip conductors on the top of the circuit board by soldering paste.
The components are embodied as multi-elements with individual contact elements which are connected by soldering paste to the strip conductors on the top of the circuit board without the danger of a soldering bridge formation. The lower contact element is connected to the underside of the circuit board in a conventional soldering bath.
Excellent large-surface soldering of the lower contact surfaces of the components in the soldering bath is obtained where the lower contact surfaces partially protrude into the bores of the circuit board from the underside of the circuit board and where the lands on the underside of the circuit board extend almost to the bores. In this way, the solder is pulled up at the contact surface.
To increase the distance of the upper centered contact surfaces to the bore in accordance with one embodiment of this invention the upper contact elements define an acute angle with the top of the circuit board.
In accordance with another embodiment of this invention the upper contact surface with the contact elements is embodied as circular contact springs extending only over parts of the circumference of the upper end of the component.
In accordance with yet a further embodiment of this invention the upper end of the component is polygonal in cross-section and provided with individual contact elements. As a result, the component can also extend beyond the bore and in this way its construction can be considerably enlarged and offer the opportunity to attach a plurality of upper contact elements.
The mechanical fixation of the components in the bores can be accomplished by a snug fit and/or press fit. In this connection, resilient outer layers of the components can also be advantageous.
In accordance with yet another embodiment of this invention, mechanical fixation is accomplished where the component body of the component is maintained sealed in the area of the bore of the circuit board by bars extending around it.
To enable identification of the component used even when assembled on the circuit board in accordance with embodiment of this invention the upper contact elements have different forms.
The connection variants for the component can also be increased where the lower contact surface and the land are also divided into several contact points insulated from each other.
BRIEF DESCRIPTI
REFERENCES:
patent: 3529212 (1967-12-01), Ballard
patent: 4878155 (1989-10-01), Conley
Picard Leo P.
Whang Young
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