Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-05-13
2010-10-05
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C361S719000, C257S706000, C362S294000, C362S373000, C165S080300
Reexamination Certificate
active
07808786
ABSTRACT:
The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.
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Kuo Hui-Ying
Liang Chi-Hao
Zhong Xie-Zhi
Chervinsky Boris L
Everlight Electronics Co., Ltd.
Rosenberg , Klein & Lee
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