Circuit board with conductor layer for increased breakdown volta

Details Circuit board with conductor layer for increased breakdown volta Circuit board with conductor layer for increased breakdown volta

1996-07-10

1999-11-16

Reichard, Dean A.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, H01R 909

Patent

active

059862181

ABSTRACT:
A circuit board includes an insulating substrate having opposed first and second surfaces and a thickness; and first and second conductive layers disposed on the first and second surfaces of the insulating substrate, respectively, wherein the first conductive layer has an end surface projecting outwardly from the first conductive layer in a direction generally parallel to the first surface of the insulating substrate, and a contact surface in contact with the insulating substrate and joining the end surface at a junction, wherein the end surface is spaced from the first surface of the insulating substrate except at the junction.

REFERENCES:
patent: 3487541 (1970-01-01), Bosewell
patent: 4164071 (1979-08-01), Kruzich
patent: 4295184 (1981-10-01), Roberts
patent: 4322777 (1982-03-01), Ueta et al.
patent: 4706165 (1987-11-01), Takenaka et al.
patent: 5296649 (1994-03-01), Kosuga et al.
patent: 5373112 (1994-12-01), Kamimura et al.
patent: 5679929 (1997-10-01), Greenfield et al.
patent: 5750271 (1998-05-01), Kuramoto et al.

Affiliated with

Also associated with

Rating

Circuit board with conductor layer for increased breakdown volta does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit board with conductor layer for increased breakdown volta, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board with conductor layer for increased breakdown volta will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1327314