Circuit board with conductive patterns formed of thermoplastic a

Details Circuit board with conductive patterns formed of thermoplastic a Circuit board with conductive patterns formed of thermoplastic a

1991-03-29

1993-04-06

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174262, 174266, H05K 100

Patent

active

052005798

ABSTRACT:
A circuit board comprising a plurality of film substrates in which films having heat deformation properties are laminated one on another, conductive patterns formed on at least one surface of each of the resin films, and connecting portions for electrically connecting the conductive patterns. The connecting portions are formed of parts of the conductive patterns, where the parts of the conductive patterns are made of conductive material including thermoplastic resin, and other parts of said conductive patterns are made of thermosetting resin.

REFERENCES:
patent: 4511757 (1985-04-01), Ors
patent: 4751126 (1988-06-01), Oodaira et al.
patent: 4791239 (1988-12-01), Shirahata
patent: 5045141 (1991-09-01), Salensky

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