Electricity: electrical systems and devices – Miscellaneous
Patent
1988-10-06
1991-12-17
Picard, Leo P.
Electricity: electrical systems and devices
Miscellaneous
361388, 361414, 361410, 174255, 101129, 428450, H05K 702
Patent
active
050738402
ABSTRACT:
A circuit board is provided having an electrically conductive substrate. Preferably, the electrically conductive substrate comprises molybdenum and copper. The substrate is selectively coated with a dielectric material which is capable of withstanding volatilization at high temperatures. The coefficient of thermal expansion of the substrate is substantially equal to that of the circuitry components which are placed thereon. A method of providing such a support structure is also disclosed.
REFERENCES:
patent: 3165672 (1965-01-01), Gellert
patent: 3202591 (1965-08-01), Curran
patent: 3296099 (1967-01-01), Dinella
patent: 3334395 (1967-08-01), Cook et al.
patent: 3514538 (1970-05-01), Chadwick et al.
patent: 3873756 (1975-03-01), Gall et al.
patent: 3934334 (1976-01-01), Hanni
patent: 4248075 (1981-02-01), Whitley
patent: 4254172 (1981-03-01), Takahashi et al.
patent: 4256796 (1981-03-01), Hang et al.
patent: 4328614 (1982-05-01), Schelhorn
patent: 4355115 (1982-10-01), Hang et al.
patent: 4365168 (1982-12-01), Chaput et al.
patent: 4383270 (1983-05-01), Schelhorn
patent: 4420364 (1983-12-01), Nukii et al.
patent: 4424251 (1984-01-01), Sugishita et al.
patent: 4496793 (1985-01-01), Hanson et al.
patent: 4509096 (1985-04-01), Baldwin et al.
patent: 4677252 (1987-06-01), Takahashi
patent: 4679122 (1987-07-01), Belke, Jr.
patent: 4700273 (1987-10-01), Kaufman
patent: 4811166 (1989-03-01), Alvarez et al.
patent: 4882454 (1989-11-01), Peterson et al.
patent: 4997698 (1991-03-01), Oboodi et al.
Surface-Mount Substrates: The Key in Going Leadless, Markstein, Electronic Packaging and Production, pp. 50-55, Jun. 1983.
Thick-Film, Multi-Layer, Chip-Carrier Circuit Fabrication on Porcelainized Metal-Core Substrates, Schelhorn, National Electronics Packaging and Production Conference (1982), pp. 81-86.
Low Cost, Increased Packaging Density with Molybdenum Substrate, Turski et al., Proceedings of the International Society for Hybrid Microelectronics (Oct. 1981), pp. 353-358.
Study of Thick Film on Stainless Steel Board, Egawa et al., Shoei Chemical, Inc., Tokyo, Japan, pp. 202-203.
High Temperature Porcelain-Coated Copper-Clad Invar Substrates, Hang, et al., RCA Laboratories, Princeton, N.J., Proceedings of International Microelectronics Conference, May 1984.
Ghosh Paramita
Microlithics Corporation
Picard Leo P.
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