Circuit board with an attached die and intermediate interposer

Details Circuit board with an attached die and intermediate interposer Circuit board with an attached die and intermediate interposer

2011-07-19

2011-07-19

Chen, Xiaoliang (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S250000, C174S255000, C174S260000, C361S760000, C361S764000, C361S767000, C361S779000, C361S792000, C257S678000, C257S686000, C257S693000, C257S700000, C257S724000, C257S774000, C257S778000

Reexamination Certificate

active

07982137

ABSTRACT:
A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients of thermal expansion of the first and second materials is positioned between the die and the board.

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