Circuit board with added impedance

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Reexamination Certificate

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Details

C361S306100, C361S794000, C361S818000, C361S763000, C174S034000, C174S250000

Reexamination Certificate

active

06775122

ABSTRACT:

FIELD OF THE INVENTION
The present invention is directed to semiconductor devices and electronic circuit boards. More particularly, the present invention is directed to added impedance in semiconductor devices and electronic circuit boards.
BACKGROUND OF THE INVENTION
Current designs of semiconductor circuits require certain impedances between the power plane and the ground plane. These impedances are generally placed on the die or on the substrate of the circuitry. For example, decoupling capacitors are typically placed in circuits, between the power plane and ground plane, to stabilize any undue voltage fluctuations in the traces. Similarly, resistances may also be used at various locations in circuits to add impedance.
FIG. 1
illustrates a semiconductor circuit with added impedance using known methods. Between a power plane
10
and ground
16
, a surface mount capacitor
12
and a surface mount resistor
14
is added. Capacitor
12
and resistor
14
are usually hand-soldered on the substrate requiring additional resources. They also occupy precious real estate on the substrate. In addition, due to the considerable length of the trace (L) between power plane
10
and ground
16
, the trace can act as an antenna for electromagnetic interference (“EMI”) and other high frequency noises.
Based on the foregoing, there is a need for an improved method and apparatus for adding impedance between planes in a semiconductor circuit.
SUMMARY OF THE INVENTION
One embodiment of the present invention is a circuit board that includes two planes. A via spans the planes, and an impedance component is placed in the via. The impedance component is coupled to both of the planes.


REFERENCES:
patent: 4091430 (1978-05-01), Berard
patent: 5038252 (1991-08-01), Johnson
patent: 5266036 (1993-11-01), Lichtenwalter et al.
patent: 5428506 (1995-06-01), Brown et al.
patent: 5568107 (1996-10-01), Buuck et al.
patent: 6061228 (2000-05-01), Palmer et al.
patent: 6150895 (2000-11-01), Steigerwald et al.
patent: 6166457 (2000-12-01), Iguchi et al.
patent: 6215372 (2001-04-01), Novak
patent: 6215373 (2001-04-01), Novak et al.
patent: 6297965 (2001-10-01), Sasaki et al.
patent: 6337798 (2002-01-01), Hailey et al.

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