Circuit board trimming apparatus and method

Details Circuit board trimming apparatus and method Circuit board trimming apparatus and method

1993-06-03

1994-10-18

Phan, Hien H.

Cutting

Other than completely through work thickness or through work...

Grooving

83 13, 83701, 451165, B24B 722, H05K 322, H01P 1205

Patent

active

053557557

ABSTRACT:
It is an object of the present invention to provide a circuit board trimming apparatus and method used, in which apparatus and method a wiring pattern on a printed circuit board is trimmed, and to provide a circuit board trimming apparatus and method, in which apparatus and method a wiring pattern is trimmed efficiently while damage to the circuit board is minimized.
A force exerted by a cutter against the circuit board is measured when the wiring pattern is cut by pressing an ultrasonic cutter against the wiring pattern on the circuit board and by moving the circuit board and the cutter relative to each other, a shape of the wiring pattern being determined on the basis of the force thus measured and a cutting process being controlled in accordance with the shape of the wiring pattern.

REFERENCES:
patent: 3471724 (1969-10-01), Balamuth
patent: 3909911 (1975-10-01), Smith et al.
patent: 4409659 (1983-10-01), Devine
patent: 5101599 (1992-04-01), Takabayasi et al.
patent: 5177902 (1993-01-01), Baba et al.

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