Circuit board transferring apparatus and method and solder...

Details Circuit board transferring apparatus and method and solder... Circuit board transferring apparatus and method and solder...

2005-12-20

2005-12-20

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

With means to handle work or product

Work portion comprises electrical component

C228S047100

Reexamination Certificate

active

06976616

ABSTRACT:
By photographing pad forming faces of CSPs400to recognize a pad arrangement through image processing so as to transfer and position the CSPs400in accordance with the recognition result of the pad arrangement, even if pads401are formed in any arrangement state in the CSPs400to be transferred, the positional relation between the pads401included in the CSPs400is made to always accurately coincide with the positional region between a plurality of solder ball attracting nozzles of a solder ball mounting apparatus.

REFERENCES:
patent: 5831247 (1998-11-01), Hidaka
patent: 5926278 (1999-07-01), Asai
patent: 6170737 (2001-01-01), Foulke et al.
patent: 6789720 (2004-09-01), Uchida et al.
patent: 6926188 (2005-08-01), Hazeyama et al.
patent: 08-236918 (1996-09-01), None
patent: 10-189868 (1998-07-01), None
patent: 11-138257 (1999-05-01), None
patent: 2001-110933 (2001-04-01), None

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