Circuit board surface structure

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S261000

Reexamination Certificate

active

08058564

ABSTRACT:
A circuit board surface structure includes a circuit board having at least one surface provided with a plurality of electrically connecting pads, an insulating protective layer characterized by photosensitivity and solder resisting and formed on the circuit board, and a plurality of openings formed in the insulating protective layer to expose the electrical connecting pads on the circuit board and tapered upward; and a conductive element formed in the opening, so as to increase the contact area and reinforce bonding between the electrically connecting pads and the conductive element.

REFERENCES:
patent: 5858824 (1999-01-01), Saitoh
patent: 2006/0252248 (2006-11-01), Hu
patent: 2006/0278997 (2006-12-01), Gibson et al.
patent: 2006/0279881 (2006-12-01), Sato
patent: 2010/0085997 (2010-04-01), Nishikawa et al.

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