Circuit board substrate with gold plated contact elements and a

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

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Details

2281802, 228248, 439 83, 29879, H05K 324, H05K 340

Patent

active

048431907

ABSTRACT:
Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces.
A method for mounting contact surface elements on the ends of strip conductors along the edge of a substrate. A solder mixed with adhesive is applied to the soldering surface at ends of the strip conductors. Contact surfaces each having a refined, f.i. gold plated, top surface and an activated, f.i. tin plated, bottom surface, are placed respectively on each soldering surface. Heat is applied to melt the solder particles and provide a good electrical connection between each surface contact and strip conductor. The substrate mounted with the contact elements has a plurality of components mounted on one surface thereof and interconnected by the strip conductors. The substrate is adapted to be plugged into an edge connector along its edge with the mounted contact surface elements.

REFERENCES:
patent: 3396461 (1968-08-01), Spooner et al.
patent: 3869787 (1975-03-01), Umbaugh
patent: 4081601 (1978-03-01), Dinella et al.
patent: 4132341 (1979-01-01), Bratschum
patent: 4728023 (1988-03-01), Barajas et al.

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