Radiation imagery chemistry: process – composition – or product th – Radiation sensitive product – Two or more radiation-sensitive layers containing other than...
Patent
1995-01-23
1999-12-21
Nuzzolillo, Maria
Radiation imagery chemistry: process, composition, or product th
Radiation sensitive product
Two or more radiation-sensitive layers containing other than...
4302731, 430394, 430 5, G03C 146
Patent
active
060047348
ABSTRACT:
A process for forming interconnection lines on a printed circuit board is described. The surface of a circuit board substrate is covered with a photoresist layer, and the photoresist layer in turn is covered with a halide emulsion layer. The emulsion layer is then exposed to a predetermined pattern of white light, and the image developed. The board is then exposed to UV light through the imaged emulsion layer which acts as a pattern masking selected portions of the photoresist mask. The emulsion layer is then stripped and the photoresist processed in conventional manner.
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patent: 5015553 (1991-05-01), Grandmont et al.
patent: 5244772 (1993-09-01), Piechowski et al.
patent: 5384230 (1995-01-01), Berg
Nuzzolillo Maria
Weiner Laura
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